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RAM Mounting Systems

RAM Mounting Systems RAP-B-238U Composite Diamond Base with 1-Inch Ball for Secure Mounting

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MSRP: $7.99
$7.49
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SKU:
44134
UPC:
793442802386
Current Stock:
4

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RAM Mounting Systems RAP-B-238U Composite Diamond Base with 1-Inch Ball for Secure Mounting
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Description

RAM Mount Composite Diamond Base w/1" Ball
Part #: RAP-B-238U

The RAP-B-238U, composite diamond base, contains a 1" diameter rubber ball connected at right angles to a 1.25" x 2.5" inch diamond plate. The base has two holes 1.912" from center to center, positioned at both ends of the diamond base.

Material:
High Strength Composite

Ball Size:
1" Rubber Ball "B" Size

The RAM Mounting Systems RAP-B-238U is a versatile and durable composite diamond base designed for secure attachment of various devices. Crafted from high-strength composite material, this base offers excellent durability and resistance to wear, making it suitable for demanding environments. The base features a 1-inch rubber ball, providing a flexible and stable connection point, and measures approximately 1/2 inch thick with a compact profile that fits easily into various mounting configurations. Its design includes two mounting holes located 1.912 inches apart, positioned at both ends of the diamond-shaped plate, facilitating straightforward installation on a variety of surfaces. The robust construction ensures a reliable hold, whether used in automotive, marine, or other mobile applications. Its lightweight build and precise dimensions make it an ideal choice for mounting equipment securely without adding unnecessary bulk to your setup.

Features:

  • Material: High strength composite for durability and resistance to environmental factors
  • Ball Size: 1-inch rubber ball provides flexibility and secure attachment
  • Design: Diamond-shaped base with two mounting holes for easy installation
  • Compatibility: Suitable for mounting a wide range of devices and accessories
  • Dimensions: Compact profile measuring approximately 1/2 inch thick, designed for versatile use

Details

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